Memory Test

AT semicon provides probe and final tests on various types of memory devices such as SRAM, flash memory, DRAM, pseudo SRAM, embedded memory, and mask ROM. It also possesses capacity of testing various types of packages such as TSOP, FBGA, uBGA, SOP PLCC, and QFP. In addition, its world-best engineering capacity supports customers with development of software programs needed in all phases from designing to probe and final tests, as well as with development of hardware (Probe cards, Sockets, Change-over kits, and Hifix boards).

System IC Test

AT semicon possesses the capacity of performing logic tests (which are applied based on digital theories including MPU, ASI, FBGA, and PLD) on such package types of mixed signal devices that include analog functions in their digital circuits. AT semicon provides on-time services of all software and hardware such as test programs, probe cards, and load boards, which are needed for wafer tests and final tests, at the most competitive cost.

CIS Test

AT semicon provides wafer probe tests and final tests on CMOS image sensors (CIS), which are the core devices of mobile phones that have been getting the brightest limelight recently. CIS tests are conducted mostly on products having 16Para and 32Para. AT semicon provides the best CIS wafer test and final test services with testers made by Teradyne and Advantest.