AT semicon provides wafer test and final test services for all types of semiconductor ICs, having established infrastructure that can test all semiconductors including memory and system semiconductors.

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  Wafer Test

  AT semicon provides various wafer test services. Not limited to wafer test services, we also provides all wafer-related test services such as the development of test programs, laser repair, automatic visual inspection, and wafer-level burn-in tests. Wafer tests can be performed within the temperature range of -55℃ through 150℃ for all existing wafers having the sizes between 5" and 12".

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  Wafer test processing

  After completing Fab processing, it goes through a reliability testing to sort out defective dies. Through the wafer test, we only assemble good quality dies and thus save on production cost. We also analyze wafers of low yield to improve the yield.

  

  Explanation on processing (wafer test)

  • 01. Checking and inspecting with the naked eye the stored wafer’s packing and documents and then categorizing its testing information.
  • 02.Creating an environment poorer than the actual inspection conditions for the device in order to authorize the device to improve the yield of the wafer test processing.
  • 03.Testing and inspecting the electric characteristics and features of the device to sort out quality and defective goods after completing processing the wafer and before packing a chip in the wafer.
  • 04.Using laser and cutting off circuits of some parts when some features in the data storage do not properly function.
  • 05.Secondary test processing of electric characteristics and features of chips inside the wafer to sort out quality and defective goods.
  • 06.Using laser beams to inspect the number and distribution of minute defective particles that cannot be distinguished with the naked eyes to judge whether the wafer is reliable.
  • 07.Shipping and storing after testing the quality of products with a high power scope of high magnification for wafers that have completed wafer tests.

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  Final Test

  AT semicon provides various package test services. The range of AT semicon’s final test service includes basic tests on electric attributes, as well as development of test programs and fabrication of interfaces that fit attributes of customer products.
  AT semicon provides tests on devices having various package types, such as SOP, TSOP, TSOP2, SSOP, QFP, QFL, LGFP, TQP, QFN, BGA, FBGA, LGA, SIP, flip-chip F-BGA, and MCP (memory + memory, memory + system IC, system IC + system IC).
  Final tests can be performed within the temperature range of -55℃ through 150℃ for memory semiconductors having 32Para through 1024Para, and for system semiconductors having 1Para through 16Para.

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  Final test processing

  Final testing of packaged chips after completing the assembly to protect it from the external environment. Because semiconductors play an important role in all home appliances around us, we only ship semiconductors that have passed our strict quality inspection.

  

  Explanation on processing (final test)

  • 01.Checking and inspecting with the naked eye the stored wafer’s packing and documents and then categorizing its testing information.
  • 02.Processing (cold test / room test / hot test) to test the electric performance and check whether it has the electric characteristics appropriate for IC.
  • 03.Using laser beams to mark special symbols / numbers / text on the device surface.
  • 04.Inspecting the exterior of end- products with the naked eye, microscope, and LIS equipment so that products with defective exteriors are not delivered to our clients.
  • 05.Baking the device itself at high temperature to remove humidity absorbed during processing of the product before packing.
  • 06.Packing into a tap and reel form for client convenience as part of product packing.
  • 07.Vacuum packing and shipping

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  Back-end Services

  For tested products, AT semicon provides various back-end services related with semiconductor tests such as laser marking, visual inspection, and baking, as well as convenient drop shipping services from packaging (tape, reel, or tray) to delivery upon customer requests.