Reliability & Failure analysis Capability

제공 Equipment Key Performance Model
Reliability HTST RT~500℃ HS-2200
HTST RT~200℃ PV-211
LTST -75℃~150℃ PG-2KTH
PCT 100~133℃ / ~100% (2ATM) PC-242III
HAST 121℃/100% 2ATM or 130℃/85% 2ATM PC-304R7
T/C -65~150℃ KR-5002
T/H -40~150℃ THG-180
T/H 0~120℃ KR-1005C
Reflow Max 350℃ XPM- 520N
Failure
Analysis
DC Tester Electrical Test of Device Characteristic AIO920
SAM (Scanning Acoustic Microscope)
Non-destructive detection of
delamination, void, crack
Quantum-350
UHR-2000
SEM (Scanning Electron Microscope) Up to x150,000 Magnification Inspection EVO-MA10
EDX (Energy Dispersive X-ray) Surface Composition Analysis NSS
Grinder / Polisher / Section Disc size : 8” /  50-350 RPM (10RPM step) RB 209
X-Ray

Real time Microfocus X-ray

ME4100-N3W
FXS-160.40
SFX-100
BST (Wire Ball Shear Test)
BST (Solder Ball Shear Test)
Joint Strength Testers
Joint Strength Testers
Dage4000
Dage2400A
WPT (Wire Pull Test) Joint Strength Testers Dage4000
Intermetalic test Joint Strength Testers (Bonderbility) -
High Power Scope Up to x1,000 Visual Inspection INM100
Wet Station Physical analysis area Wet Station
Warpage simulation Package warpage simulation test AXP

Reliability Procedure

ITEM Ref. Standard ITEM Ref. Standard
PRECONDITION JSTD020D-01, JESD22-A113 HTST JESD22A-103
LTST JESD22A-119 THS JEDS22A-101
PCT JESD22A-102 T/C JESD22A-104
HAST JESD22A-118 SAM JSTD035, JSTD020D-01
Whisker Test JESD22-A121 Warpage Measurement JESD22B-112